Constant Temperature & Humidity Workshop:
Recommended humidity for coating zone: 40–60% RH;
Temperature: 23±2℃.
Dew Point Management:
Substrate temperature must be at least 3℃ above the ambient dew point to prevent condensation.
Local Microenvironment Control:
For plants unable to achieve full constant temperature and humidity, implement local temperature and humidity control at the coating head and oven inlet.
Solvent System Optimization:
Under high-humidity conditions: add fast-drying solvents (e.g., toluene, heptane) to accelerate volatilization
Curing Parameter Reset:
Under high-humidity conditions: extend curing time by 10–20% and increase temperature by 5–10℃.
Substrate Drying:
Dehumidify the substrate using a 50–80℃ heating roll before coating (especially for paper-based / porous materials).
Release film coating is far more sensitive to humidity than conventional coatings, so humidity control is critical for release coating, due to the core pain points:
① Platinum catalyst undergoes irreversible deactivation upon contact with water → catastrophic curing failure.
② Release force requires extremely high precision (within ±10%) → minor fluctuations cause batch rejection.
Solutions must be prevention‑oriented:
Build a triple defense line through environmental isolation, substrate dehumidification, and process optimization, rather than relying only on process remediation.
